Innodisk, in collaboration with Qualcomm Technologies, has released the EXEC-Q911, a ruggedized development kit built around a COM-HPC Mini module mounted on a dedicated carrier board for industrial edge workloads. Part of the company’s “AI on Dragonwing” series, the platform targets robotics, smart infrastructure, and edge LLM applications. The compatible COM-HPC Mini Module EXMP-Q911 is […]
from LinuxGizmos.com https://ift.tt/HPOvQMn
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