AAEON presents new COM Express modules at Embedded World 2022

AAEON has announced a few new products ahead of Embedded World 2022. The NanoCOM-TGU and COM-ICDB7 are COM Express modules that feature Intel’s Tiger Lake UP3 SoC processor and Intel’s SoC Xeon D LCC processor respectively. AAEON’s NanoCOM-TGU COM Express module offers support for the following 11th Gen processors from Intel: Core i7-1187G7E — four-core […]

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